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RENOTHERM GFB (Gypsum fibreboard)

RENOTHERM GFB (Gypsum fibreboard)

Composite panels for interior wall and attic floor combining a PIR insulating core and interior finishing.

  • Consist of an insulating core of a high performance PIR foam with a gastight, low emissivity aluminium composite foil facing and a top-mounted interior panel
  • Manufactured in accordance with EN 13165
  • Thermal conductivity 0,022 W/mK

Product specifications

Technical data Insulating core
Application Type Inside pitched roof/attic floor
Edge finish 11 mm tongue and groove
Dimensions

1200 x 600 mm (Board Dimension)
1189 x 589 mm (Net coverage area)

Compressive Strenght  ≥ 150 Kpa
Thermal Conductivity 0,022 W/mK
Fire Rating F in accordance with EN 13165

 

Technical data Interior boards
Thickness 10 mm
Profile 4-sided tapered edges
Application Wall inside pichted roof

Product name
Insulation Panel Renotherm R-Value Sheets/pack m²/pack  Weight 
RENOTHERM GFB (GYPSUM FIBREBOARD) 82 10 92 3,70 2 1,44 9,90
RENOTHERM GFB (GYPSUM FIBREBOARD) 100 10 110 4,50 2 1,44 10,30
RENOTHERM GFB (GYPSUM FIBREBOARD) 120* 10 130 5,45 2 1,44 10,80
RENOTHERM GFB (GYPSUM FIBREBOARD) 140* 10 150 6,35 2 1,44 11,20
*Minimum order quantity and delivery upon consultation

Accessories

Here you can find the accessories

Flex foam

Flexible PU foam to fill up joints between the boards and surrounding areas.

Downloads

UTHERM Other countries delivery programma

Download (PDF)

Related products

RENOTHERM GYP

  • Consist of an insulating core of a high performance PIR foam with a gastight, low emissivity aluminium composite foil facing and a top-mounted interior panel
  • Manufactured in accordance with EN 13165
  • Thermal conductivity 0,022 W/mK

RENOTHERM OSB BOARD

  • Consist of an insulating core of a high performance PIR foam with a gastight, low emissivity aluminium composite foil facing and a top-mounted interior panel
  • Manufactured in accordance with EN 13165
  • Thermal conductivity 0,022 W/mK

UTHERM FLOOR PIR L

  • High performance rigid PIR foam insulation board
  • The board comprises a gastight, low emissivity aluminium composite foil facing with a printed grid (10 x 10 cm)
  • Manufactured in accordance with EN 13165
  • Thermal conductivity 0,022 W/mK

RENOTHERM CHIPBOARD

  • Consist of an insulating core of a high performance PIR foam with a gastight, low emissivity aluminium composite foil facing and a top-mounted interior panel
  • Manufactured in accordance with EN 13165
  • Thermal conductivity 0,022 W/mK

UNILIN likes to help you with your insulation project

Downloads

Have a look at our brochures, technical files and other documents