RENOTHERM CHIPBOARD

Composite panels for interior wall and attic floor combining a PIR insulating core and interior finishing

  • Consist of an insulating core of a high performance PIR foam with a gastight, low emissivity aluminium composite foil facing and a top-mounted interior panel
  • Manufactured in accordance with EN 13165
  • Thermal conductivity 0,022 W/mK

Product specifications

Technical data Insulating core
Application Type Inside pitched roof/attic floor
Edge finish Combined tongue and groove system
Dimensions

1205 x 613 mm (Board Dimension)
1194 x 602 mm (Net coverage area)

Compressive Strenght  ≥ 150 Kpa
Thermal Conductivity 0,022 W/mK
Fire Rating F in accordance with EN 13165

 

Straight Edge
Technical data Interior boards
Thickness 8 mm
Profile  Straight Edge
Application Wall and Floor

Product name
Insulation Panel Renotherm R-Value Sheets/pack m²/pack  Weight 
RENOTHERM CB (CHIPBOARD) 80* 8 88 3,65 2 1,44 6,00
RENOTHERM CB (CHIPBOARD) 100* 8 108 4,50 2 1,44 6,50
RENOTHERM CB (CHIPBOARD) 120* 8 128 5,45 2 1,44 7,00
RENOTHERM CB (CHIPBOARD) 140* 8 148 6,05 2 1,44 7,40
*Minimum order quantity and delivery upon consultation

Accessories

Here you can find the accessories

Flex foam

Flexible PU foam to fill up joints between the boards and surrounding areas.

PU-Gun

Downloads

UTHERM Other countries delivery programma

Download (PDF)

Data sheet - Renotherm

Download (PDF)

Declaration of Performance - Renotherm CB

Download (PDF)

Related products

RENOTHERM GYP

  • Consist of an insulating core of a high performance PIR foam with a gastight, low emissivity aluminium composite foil facing and a top-mounted interior panel
  • Manufactured in accordance with EN 13165
  • Thermal conductivity 0,022 W/mK

RENOTHERM GFB (Gypsum fibreboard)

  • Consist of an insulating core of a high performance PIR foam with a gastight, low emissivity aluminium composite foil facing and a top-mounted interior panel
  • Manufactured in accordance with EN 13165
  • Thermal conductivity 0,022 W/mK

RENOTHERM OSB BOARD

  • Consist of an insulating core of a high performance PIR foam with a gastight, low emissivity aluminium composite foil facing and a top-mounted interior panel
  • Manufactured in accordance with EN 13165
  • Thermal conductivity 0,022 W/mK

UTHERM FLOOR PIR L

  • High performance rigid PIR foam insulation board
  • The board comprises a gastight, low emissivity aluminium composite foil facing with a printed grid (10 x 10 cm)
  • Manufactured in accordance with EN 13165
  • Thermal conductivity 0,022 W/mK

UNILIN likes to help you with your insulation project

Downloads

Have a look at our brochures, technical files and other documents